System Cooling

Adhesives & Thermal Material

Heat is the enemy of your processor.

Antec's Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 6 for a diamond-caliber solution. Features

Arctic Cooling Freezer 7 Pro Rev.2 Copper Core/Aluminum Fin Heat Sink & Fan w/4-Pin Connector For Intel & AMD Cpus

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Antec Formula 6 Thermal Compound

Antec s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6 s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30 C and 250 C. To keep your system cool and your CPU functioning comfortably, pick up Antec s Formula 6 for a diamond-caliber solution.

This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.

This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.

Contains 99.9% pure silver: Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-partic le contact area and thermal transfer. Not Electrically Conductive: Arctic Silver 5 was formulated to conduct heat, not electricity. (While much safer than electrically conductive silver and copper greases, Arctic Silver 5 should be kept away from electrical traces, pins, and leads. While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.) Absolute Stability: Arctic Silver 5 will not separate, run, migrate, or bleed. Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when... Less

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Freezer 7 Pro Rev. 2 is a high performance CPU cooler for Intel and AMD. The heatsink features 6 heatpipes and 42 fins for efficient heat dissipation. Thanks to the vibration absorption, the fan is whisper-quiet even at full load.

THERMALRIGHT CHILL FACTOR II THERMAL PASTE W/ PASTE SPREADING CARD

The Alpine 11 Pro Rev.2 is the ideal cost-efficient heatsink for system builders. The multi compatible cooler is suitable for upgrade or replacement of noisy stock coolers.

THERMAL PAD - REPLACES HEATSINK - PASTE StarTech HSFPHASECM Thermal Pad Heatsink Paste Alternative; Package of 5

Freezer 7 Pro Rev. 2 is a high performance CPU cooler for Intel and AMD. The heatsink features 6 heatpipes and 42 fins for efficient heat dissipation. Thanks to the vibration absorption, the fan is whisper-quiet even at full load.

Like the original Céramique, Céramique 2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri-linear composite of aluminum oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically-sized particles and new ultra-high shear mixing techniques maximize Céramique 2's thermal performance and help maintain a stable homogenous suspension. This exclusive combination provides performance exceeding most metal based compounds.

Thermal Compound COOLER Thermal Compound - HTK-002-U1 Thermal compound; Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials; heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity; low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F); maintaining a positive heat sink seal to improve heat transfer from the electronic device to the h