AMD Opteron 4170 HE, 2.1 GHz (OS4170OFU6DGOWOF) Processor

AMD Opteron 4170 HE 6-Core Lisbon 2.1GHz 6 x 512KB L2 Cache 6MB L3 Cache Socket C32 50W Processor OS4170OFU6DGOWOF - Retail

New AMD-P 2.0 Power Savings Features: Ultra-low power platforms provide power efficiency beyond just the processor, for both 1P and 2P server configurations. APML (Advanced Platform Management Link) provides an interface for processor and systems management monitoring and controlling of system resources such as platform power consumption via p-state limits and CPU thermals to closely monitor power and cooling. Link Width PowerCap which changes all 16-bit links to 8-bit links can help power conscious customers improve performance-per-wa tt. AMD CoolSpeed Technology reduces p-states when a temperature limit is reached to allow a server to operate if the processor’s thermal environment exceeds safe operational limits. When C1E is enabled, the cores, southbridge and memory controller enter a sleep state that can equate to significant power savings in the datacenter depending on system configuration. LV-DDR3 memory support helps to reduce overall system power consumption. Direct Connect Architecture 2.0: Dual Channel DDR3 Memory enables improved overall system performance and investment protection compared to earlier technologies. R/U-DDR3 Memory up to 1333MHz enables improved overall system performance compared to earlier memory technologies. HyperTransport Technology Assist [HT Assist] helps increases HyperTransport technology efficiency by reducing probe traffic and resolving probe issues. HyperTransport 3.0 Technology (HT3) with increased speed over prior generations, up to 6.4GT/s helps improve overall system balance and scalability. AMD-V 2.0 supports I/O level virtualization to provide direct control of device by a VM7 and improve I/O performance within a virtual machine.

AMD Opteron 4170 HE 6-Core Lisbon 2.1GHz 6 x 512KB L2 Cache 6MB L3 Cache Socket C32 50W Processor OS4170OFU6DGOWOF - Retail

New AMD-P 2.0 Power Savings Features: Ultra-low power platforms provide power efficiency beyond just the processor, for both 1P and 2P server configurations. APML (Advanced Platform Management Link) provides an interface for processor and systems management monitoring and controlling of system resources such as platform power consumption via p-state limits and CPU thermals to closely monitor power and cooling. Link Width PowerCap which changes all 16-bit links to 8-bit links can help power conscious customers improve performance-per-wa tt. AMD CoolSpeed Technology reduces p-states when a temperature limit is reached to allow a server to operate if the processor’s thermal environment exceeds safe operational limits. When C1E is enabled, the cores, southbridge and memory controller enter a sleep state that can equate to significant power savings in the datacenter depending on system configuration. LV-DDR3 memory support helps to reduce overall system power consumption. Direct Connect Architecture 2.0: Dual Channel DDR3 Memory enables improved overall system performance and investment protection compared to earlier technologies. R/U-DDR3 Memory up to 1333MHz enables improved overall system performance compared to earlier memory technologies. HyperTransport Technology Assist [HT Assist] helps increases HyperTransport technology efficiency by reducing probe traffic and resolving probe issues. HyperTransport 3.0 Technology (HT3) with increased speed over prior generations, up to 6.4GT/s helps improve overall system balance and scalability. AMD-V 2.0 supports I/O level virtualization to provide direct control of device by a VM7 and improve I/O performance within a virtual machine.